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features description applications SN65HVD379 slls667a ? february 2006 ? revised may 2006 3.3 v full-duplex rs-485/rs-422 drivers and balanced receivers designed for interbus applications the SN65HVD379 is a differential line driver and differential-input line receiver that operates with a balanced receiver thresholds 3.3-v power supply. each driver and receiver has 1/2 unit-load (up to 64 nodes on the bus) separate input and output pins for full-duplex bus bus-pin esd protection 15 kv hbm communication designs. they are designed for bus-fault protection of ?7v to 12v balanced transmission lines and interoperation with ansi tia/eia-485a, tia/eia-422-b, itu-t v.11, and thermal shutdown protection iso 8482:1993 standard-compliant devices. power-up/down glitch-free bus inputs and these differential bus drivers and receivers are outputs monolithic, integrated circuits designed for full-duplex high input impedance with low v cc bi-directional data communication on multipoint monotonic outputs during power cycling bus-transmission lines at signaling rates (1) up to 25 mbps. the SN65HVD379 is fully enabled with no 5v tolerant inputs external enabling pins. the 1/2 unit load receiver has a higher receiver input digital motor control resistance. this results in lower bus leakage currents over the common-mode voltage range, and reduces utility meters the total amount of current that an rs-485 driver is chassis-to-chassis interconnections forced to source or sink when transmitting. electronic security stations the balanced differential receiver input threshold industrial, process, and building automation makes the SN65HVD379 more compatible with point-of-sale (pos) terminals and networks fieldbus requirements that define an external failsafe dte/dce interfaces structure. (1) the signaling rate of a line is the number of voltage transitions that are made per second expressed in the units bps (bits per second). balanced receiver input thresholds SN65HVD379 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. production data information is current as of publication date. copyright ? 2006, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. www .ti.com v id 0 v -0.05 v 0.05 v 0.10 v -0.10 v -0.15 v -0.20 v 0.15 v 0.20 v v it+ (t y p ) v (t y p ) recevier output high receiver output low it C rd b a z y 7 8 6 5 23 d p (top view) ackage 12 3 4 87 6 5 rd v cc b az y gnd
absolute maximum ratings recommended operating conditions SN65HVD379 slls667a ? february 2006 ? revised may 2006 this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ordering information signaling rate unit loads part number (1) soic marking 25 mbps 1/2 SN65HVD379 (1) these are the d package is available taped and reeled. add an r suffix to the part number (ie. SN65HVD379dr). over operating free-air temperature range unless otherwise noted (1) (2) unit v cc supply voltage range ?0.3 v to 6 v v a , v b , v y , v z voltage range at any bus terminal (a, b, y, z) ?9 v to 14 v v trans voltage input, transient pulse through 100 w . see figure 8 (a, b, y, z) (3) ?50 to 50 v v i input voltage range (d, de, re) -0.5 v to 7 v p cont continuous total power dissipation internally limited (4) i o output current (receiver output only, r) 11 ma (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltage values, except differential i/o bus voltages, are with respect to network ground terminal. (3) this tests survivability only and the output state of the receiver is not specified. (4) the thermal shutdown protection circuit internally limits the continuous total power dissipation. thermal shutdown typically occurs when the junction temperature reaches 165c. over operating free-air temperature range unless otherwise noted parameter min nom max unit v cc supply voltage 3.0 3.6 v v i or v ic voltage at any bus terminal (separately or common mode) ?7 (1) 12 1/t ui signaling rate SN65HVD379 25 mbps r l differential load resistance 54 60 w v ih high-level input voltage d 2 v cc v il low-level input voltage d 0 0.8 v v id differential input voltage ?12 12 driver ?60 i oh high-level output current ma receiver ?8 driver 60 i ol low-level output current ma receiver 8 t a ambient still-air temperature ?40 85 c (1) the algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet. 2 submit documentation feedback www .ti.com
electrostatic discharge protection driver electrical characteristics driver switching characteristics SN65HVD379 slls667a ? february 2006 ? revised may 2006 parameter test conditions min typ (1) max unit human body model bus terminals and gnd 16 human body model (2) all pins 4 kv charged-device-model (3) all pins 1 (1) all typical values at 25c with 3.3-v supply. (2) tested in accordance with jedec standard 22, test method a114-a. (3) tested in accordance with jedec standard 22, test method c101. over recommended operating conditions unless otherwise noted parameter test conditions min typ (1) max unit v i(k) input clamp voltage i i = ?18 ma ?1.5 i o = 0 2.0 v cc r l = 54 w , see figure 1 (2) (rs-485) 1.5 2.0 |v od(ss) | steady-state differential output voltage r l = 100 w , see figure 1 (rs-422) 2.0 2.3 v test = ?7 v to 12 v, see figure 2 1.5 change in magnitude of steady-state d |v od(ss) | r l = 54 w , see figure 1 and figure 2 ?0.2 0.2 v differential output voltage between states differential output voltage overshoot and r l = 54 w , c l = 50 pf, see figure 5 v od(ring) 10% (3) undershoot (figure 3 for definitions) v oc(pp) peak-to-peak common-mode output voltage 0.5 v oc(ss) steady-state common-mode output voltage 1.6 2.3 see figure 3 change in steady-state common-mode output d v oc(ss) ?0.05 0.05 voltage v cc = 0 v, v z or v y = 12 v, 90 other input at 0 v i z(z) or high-impedance state output current m a i y(z) v cc = 0 v, v z or v y = ?7 v, ?10 other input at 0 v v z or v y = ?7 v ?250 250 i z(s) or other input short circuit output current ma i y(s) at 0 v v z or v y = 12 v ?250 250 i i input current d v i = 0 or v i = 2.0 0 100 a v od = 0.4 sin (4e6 p t) + 0.5 v, c (od) differential output capacitance 16 pf v cc at 0 v (1) all typical values are at 25c and with a 3.3-v supply. (2) v cc is 3.3 vdc 5% (3) 10% of the peak-to-peak differential output voltage swing, per tia/eia-485. over recommended operating conditions unless otherwise noted parameter test conditions min typ (1) max unit t plh propagation delay time, low-to-high-level output 4 10 18 ns t phl propagation delay time, high-to-low-level output t r differential output signal rise time r l = 54 w , c l = 50 pf, see figure 5 2.5 5 12 ns t f differential output signal fall time t sk(p) pulse skew (|t phl ? t plh |) 0.6 ns t sk(pp) (2) part-to-part skew 1 ns (1) all typical values are at 25c and with a 3.3-v supply. (2) t sk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits. 3 submit documentation feedback www .ti.com
receiver electrical characteristics receiver switching characteristics device power dissipation ? p d function tables SN65HVD379 slls667a ? february 2006 ? revised may 2006 over recommended operating conditions unless otherwise noted parameter test conditions min typ (1) max unit positive-going differential input threshold v it+ i o = ?8 ma 0.2 voltage v negative-going differential input threshold v it? i o = 8 ma ?0.2 voltage v hys hysteresis voltage (v it+ ? v it? ) 50 mv v id = 200 mv, i o = ?8 ma, see figure 7 2.4 v o output voltage v v id = ?200 mv, i o = 8 ma, see figure 7 0.4 v a or v b = 12 v 0.20 0.35 v a or v b = 12 v, v cc = 0 v 0.24 0.40 i a or other input bus input current ma i b at 0 v v a or v b = -7 v ?0.35 ?0.18 v a or v b = -7 v, v cc = 0 v ?0.25 ?0.13 c id differential input capacitance v id = 0.4 sin (4e6 p t) + 0.5 v, de at 0 v 15 pf i cc supply current d at 0 v or v cc and no load 2.1 ma (1) all typical values are at 25c and with a 3.3-v supply. over recommended operating conditions unless otherwise noted parameter test conditions min typ (1) max unit t plh propagation delay time, low-to-high-level output v id = ?1.5 v to 1.5 v, c l = 15 pf, 26 45 ns see figure 7 t phl propagation delay time, high-to-low-level output t sk(p) pulse skew (|t phl - t plh |) 7 t sk(pp) part-to-part skew (2) 5 t r output signal rise time 5 t f output signal fall time 6 (1) all typical values are at 25c and with a 3.3-v supply (2) t sk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits. parameter test conditions min typ max unit p d device power dissipation r l = 60 , c l = 50 pf, input to d a 50% duty cycle square wave at 197 mw indicated signaling rate t a = 85c driver receiver input outputs differential inputs outputs d y z v id = v a ?v b r h h l v id ? 0.2 v l l l h ?0.2 v < v id < 0.2 v ? open l h 0.2 v v id h 4 submit documentation feedback www .ti.com
parameter measurement information SN65HVD379 slls667a ? february 2006 ? revised may 2006 figure 1. driver v od test circuit and voltage and figure 2. driver v od with common-mode loading test current definitions circuit figure 3. v od(ring) waveform and definitions v od(ring) is measured at four points on the output waveform, corresponding to overshoot and undershoot from thev od(h) and v od(l) steady state values. figure 4. test circuit and definitions for the driver common-mode output voltage 5 submit documentation feedback www .ti.com 60 1% v od 0 or 3 v _ + ?7 v < v (test) < 12 v yz d 375 1% 375 1% i y v od r l 0 or 3 v v y v z i z i i v i yz v od(ring) v od(ring) -v od(ss) v od(ss) 0 v differential v oc 27 1% input yz v y v z v oc(pp) ?v oc(ss) v oc 27 1% c l = 50 pf 20% d yz input: prr = 500 khz, 50% duty cycle,t r <6ns, t f <6ns, z o = 50 c l includes fixture and instrumentation capacitance
SN65HVD379 slls667a ? february 2006 ? revised may 2006 parameter measurement information (continued) figure 5. driver switching test circuit and voltage waveforms figure 6. receiver voltage and current definitions figure 7. receiver switching test circuit and voltage waveforms figure 8. test circuit, transient over voltage test 6 submit documentation feedback www .ti.com y z w w w ? ? v id v a v b i o a b i b v o r i a v ic v a + v b 2 input generator 50 generator: prr = 500 khz, 50% duty cycle, t r <6 ns, t f <6 ns, z o = 50 v o 1.5 v 1.5 v 1.5 v 3 vv oh v ol 1.5 v 10% 1.5 v t plh t phl t r t f 90% v i v o c l = 15 pf 20% c includes fixture and instrumentation capacitance l a b v i r 0 v 90% 10% b a r 100 w 1% + - pulse generator 15 m s duration 1% duty cycle t , t 100 ns r f z y d 100 w 1% + -
equivalent input and output schematic diagrams SN65HVD379 slls667a ? february 2006 ? revised may 2006 r1/r2 r3 SN65HVD379 9 k w 45 k w 7 submit documentation feedback www .ti.com v cc input 470 w 125 k w 9 v d input r3 22 v 22 v input r2 r1 v cc b input 16 v 16 v y and z outputs output v cc r3 22 v 22 v input r2 r1 v cc a input v cc 5 w output r output 9 v
typical characteristics SN65HVD379 slls667a ? february 2006 ? revised may 2006 rms supply current bus input current vs vs signaling rate input voltage figure 9. figure 10. driver low-level output current driver high-level output current vs vs low-level output voltage high-level output voltage figure 11. figure 12. 8 submit documentation feedback www .ti.com 30 35 40 45 50 55 0 5 10 15 20 25 signaling rate - mbps i - rms supply current - ma c c t =25c r = 54 = v c = 50 pf de = v a l cc l cc w re v = 3.3 v cc -200 -150 -100 -50 50 0 100 150 200 250 -7 -4 -1 2 5 8 11 14 v - bus input voltage - v i i - bus input current - ua i t = 25c = 0 v de = 0 v a re v = 3.3 v cc -0.02 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0 0.5 1 1.5 2 2.5 3 3.5 v - low-level output voltage - v ol i - low-level output current - a ol v = 3.3 v de = v d = 0 v cc cc -0.13 -0.11 -0.09 -0.07 -0.05 -0.03 -0.01 0.01 0 0.5 1 1.5 2 2.5 3 3.5 v - high-level output voltage - v oh i - high-level output current - a oh v = 3.3 v de = v d = 0 v cc cc
SN65HVD379 slls667a ? february 2006 ? revised may 2006 typical characteristics (continued) driver differential output voltage driver output current vs vs free-air temperature supply voltage figure 13. figure 14. 9 submit documentation feedback www .ti.com 1.8 1.9 2.0 2.1 2.2 -40 -15 10 35 60 85 t - free air temperature - c a v - driver differential v oltage - v od v = 3.3 v de = v d = cc cc v cc 0 5 10 15 20 25 30 35 40 0 0.5 1 1.5 2 2.5 3 3.5 v supply voltage - v cc i - driver output current - ma o t = 25c r = 54 d = v de = v a l cc cc w
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN65HVD379d active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN65HVD379dg4 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN65HVD379dr active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN65HVD379drg4 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 18-jul-2006 addendum-page 1
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN65HVD379dr soic d 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN65HVD379dr soic d 8 2500 346.0 346.0 29.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

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